| Sl.No | Item Name | Quantity |
|---|---|---|
| 1 | ASIC FABRICATION: Fabrication of ASICs in MPW mode in vendor proposed 28nm CMOS process with die area of 6 mm2 as per RFP No: Doc No. HSTA/TEC/3/23-05 | 6Cycle |
| 2 | ASIC FABRICATION: Additional fabrication cost for per mm2 of chip area for vendor proposed 28nm CMOS process as per RFP No: Doc No. HSTA/TEC/3/23-05 | 38Nos. |
| 3 | ASIC FABRICATION: Assembly and packaging of 20 Nos of dies per MPW run in CQFP 208L package as per RFP No: Doc No. HSTA/TEC/3/23-05 | 2Cycle |
| 4 | ASIC FABRICATION: Assembly and packaging of 20 Nos of dies per MPW run in CQFP 100L package as per RFP No: Doc No. HSTA/TEC/3/23-05 | 6Cycle |