Sl.No Item Name Quantity
1 ASIC FABRICATION: Fabrication of ASICs in MPW mode in vendor proposed 28nm CMOS process with die area of 6 mm2 as per RFP No: Doc No. HSTA/TEC/3/23-05 6Cycle
2 ASIC FABRICATION: Additional fabrication cost for per mm2 of chip area for vendor proposed 28nm CMOS process as per RFP No: Doc No. HSTA/TEC/3/23-05 38Nos.
3 ASIC FABRICATION: Assembly and packaging of 20 Nos of dies per MPW run in CQFP 208L package as per RFP No: Doc No. HSTA/TEC/3/23-05 2Cycle
4 ASIC FABRICATION: Assembly and packaging of 20 Nos of dies per MPW run in CQFP 100L package as per RFP No: Doc No. HSTA/TEC/3/23-05 6Cycle