| 1 |
Supply Installation and Commisioning of Dark field defect inspection equipment – KLA PUMA |
1Nos.
|
| 2 |
Supply Installation and commisioning of Surfscan- KLA SP1 TBI |
1Nos.
|
| 3 |
Supply installation and commisioning of Asher- Mattson Aspen II |
1Nos.
|
| 4 |
Supply Installation and Commisioning of Polymer strip equipment after VIA and metal etch, LAM DVI (DV24) |
1Nos.
|
| 5 |
Supply Installation and Commisioning of Metal Sputter equipment, AMAT Endura |
1Nos.
|
| 6 |
Supply Installation and commisioning of Bright Field defect inspection equipment, KLA 2367 PRO |
1Nos.
|
| 7 |
Supply Installation and commisioning of Photoresist strip Pre diffusion clean ZETA VIPER |
1Nos.
|
| 8 |
Supply installation and comisioning of Oxide etcher, LAM EXELAN 2300/TEL UNITY ME |
1Nos.
|
| 9 |
CMOX1,CMP Oxide,1. In-situ end point system |
1Nos.
|
| 10 |
CMOX1,CMP Oxide,2. POU Filter Upgrade |
1Nos.
|
| 11 |
CMOX1,CMP Oxide,3. Upgradation of Slurry recirculation and delivery pump in MABAT (CDU 3000) Slurry Delivery System |
1Nos.
|
| 12 |
CMOX1,CMP Oxide,4. Hard disk upgrade (from mechanical HDD to RAID SSD) |
1Nos.
|
| 13 |
CMOX1,CMP Oxide,5. Upper Pneumatic Assembly (UPA) module upgrade |
1Nos.
|
| 14 |
CMOX1,CMP Oxide,6. Upgrade from peristaltic pump to CLC for slurry loop |
1Nos.
|
| 15 |
CMOX1,CMP Oxide,7. Slurry Injection System (SIS) |
1Nos.
|
| 16 |
CMOX1,CMP Oxide,8. Upgrade Slurry/DIW main valve from 1 line to 3 line |
1Nos.
|
| 17 |
CMWO1,CMP Tungsten,1. POU Filter Upgrade |
1Nos.
|
| 18 |
CMWO1,CMP Tungsten,2. Upgradation of Slurry recirulation and delivery pump in MABAT Slurry Delivery System |
1Nos.
|
| 19 |
CMWO1,CMP Tungsten,3. Hard disk upgrade (from mechanical HDD to RAID SSD) |
1Nos.
|
| 20 |
CMWO1,CMP Tungsten,4. UPA (Upper Pneumatic Assembly) module upgrade |
1Nos.
|
| 21 |
CMWO1,CMP Tungsten,5. Upgrade from peristaltic pump to CLC for slurry loop |
1Nos.
|
| 22 |
CMWO1,CMP Tungsten,6. Slurry Injection System (SIS) |
1Nos.
|
| 23 |
CMWO1,CMP Tungsten,7. Upgrade Slurry/DIW main valve from 1 line to 3 line |
1Nos.
|
| 24 |
MTOP2,Film Thickness and Reflectance Measurement,1 Install Mini environment |
1Nos.
|
| 25 |
MTOP2,Film Thickness and Reflectance Measurement,2. SMIF upgrade |
1Nos.
|
| 26 |
MTOP2,Film Thickness and Reflectance Measurement,3. Wedge Calibration wafer |
1Nos.
|
| 27 |
REML1,Metal Etcher (1 DPS ch and 1 ASP ch),1. chamber addition 1 DPS chamber and 1ASP chamber |
1Nos.
|
| 28 |
REML1,Metal Etcher (1 DPS ch and 1 ASP ch),2. Change the existing 4.2Mb hard disk to flash drive |
1Nos.
|
| 29 |
REML1,Metal Etcher (1 DPS ch and 1 ASP ch),3. Change the floppy drive to USB drive |
1Nos.
|
| 30 |
REML1,Metal Etcher (1 DPS ch and 1 ASP ch),4. Existing Buffer CH Viewport window to be upgraded with sapphire glass |
1Nos.
|
| 31 |
REPL1,Poly Si / STI Etcher,1. Upgradation of existing Dome Temp. Control Unit (DTCU) of both the Chambers ( Including Source Rf match) |
1Nos.
|
| 32 |
REPL1,Poly Si / STI Etcher,2. Change the floppy drive to USB drive |
1Nos.
|
| 33 |
REPL1,Poly Si / STI Etcher,3. EPD system with EP monitoring at the top of dome for one chamber (AA Etch) only |
1Nos.
|
| 34 |
IMHE1,High Energy Implanter,1. Additional wafer Buffer Loader |
1Nos.
|
| 35 |
IMHE1,High Energy Implanter,2. Software Upgrade (SunSystem Upgrade and Night backup recorder installation.) |
1Nos.
|
| 36 |
TRMU1,Track MUV ,1. Additional - 1 Hot Plate (HHP) |
1Nos.
|
| 37 |
TRMU1,Track MUV ,2. Temperature and Humidity Controller Upgrade |
1Nos.
|
| 38 |
TRDU1,Track DUV,1. Upgrade PLC on Developer LDS |
1Nos.
|
| 39 |
SNDU1,Scanner DUV,1. Installation of Quadrpole Aperture (Resolution improvement) |
1Nos.
|
| 40 |
MTCD1,CD SEM,SMIF upgrade |
1Nos.
|
| 41 |
CDHD1,HDP Oxide CVD (3 ch),1.Replace ETO RF generator for two chambers with ENI RF generators |
1Nos.
|
| 42 |
CDHD1,HDP Oxide CVD (3 ch),2. Change the existing 4.2Mb hard disk to flash drive |
1Nos.
|
| 43 |
CDHD1,HDP Oxide CVD (3 ch),3. Change the floppy drive to USB drive |
1Nos.
|
| 44 |
CDTS1,PECVD TEOS ,1.Up-grade with RPS |
1Nos.
|
| 45 |
CDTS1,PECVD TEOS ,2. SACVD chamber addition |
1Nos.
|
| 46 |
CDTS1,PECVD TEOS ,3. Change the existing 4.2Mb hard disk to flash drive |
1Nos.
|
| 47 |
CDTS1,PECVD TEOS ,4. Change the floppy drive to USB drive |
1Nos.
|
| 48 |
SPCO1,Silicide PVD Sputter,1.Upgradation of Conventional Ti Chamber for TiN capability |
1Nos.
|
| 49 |
SPCO1,Silicide PVD Sputter,2. Change the existing 4.2Mb hard disk to flash drive |
1Nos.
|
| 50 |
SPCO1,Silicide PVD Sputter,3. Change the floppy drive to USB drive |
1Nos.
|
| 51 |
SPLR1,Barrier Metal Deposition,1.High speed robot configuration |
1Nos.
|
| 52 |
SPLR1,Barrier Metal Deposition,2. Change the existing 4.2Mb hard disk to flash drive |
1Nos.
|
| 53 |
SPLR1,Barrier Metal Deposition,3. Change the floppy drive to USB drive |
1Nos.
|
| 54 |
MTFR1,FTIR Spectroscopy,Upgradation for B,P, and Si-OH bond measurement capability. |
1Nos.
|
| 55 |
WTSE1,Single Wafer Spin Processor,Chuck Upgrade in both module- Wafer edges can be better handle with upgraded Chuck. |
1Nos.
|
| 56 |
WTSE1,Single Wafer Spin Processor,Upgradation of CDS to handle 200 Ltr drum for catering increase chemical consumption with increase capacity |
1Nos.
|
| 57 |
WTSE1,Single Wafer Spin Processor,O3 generator upgrade |
1Nos.
|
| 58 |
WTSE1,Single Wafer Spin Processor,Addition Heat exchanger for Med 2 |
1Nos.
|
| 59 |
SBXC1,Pod and Cassette Cleaner,PLC upgrade |
1Nos.
|
| 60 |
SSRT1,Wafer Sorter - Wafer Start,Upgrade to wafer Back side reading |
1Nos.
|
| 61 |
SSRT2,Wafer Sorter - Common Area,Upgrade to wafer Back side reading |
1Nos.
|
| 62 |
WTPD1,Batch processing ,1.O3 generator |
1Nos.
|
| 63 |
WTPD1,Batch processing ,2. Mega sonic generator |
1Nos.
|
| 64 |
WTPD1,Batch processing ,3. CD upgrade |
1Nos.
|
| 65 |
WTRS1,Batch processing ,1. CD upgrade |
1Nos.
|
| 66 |
WTRS1,Batch processing ,2. Mega sonic generator |
1Nos.
|
| 67 |
YEDR1,CP measurement upgraded for Computer hardware, Windows Operating Syasuremeupgraded for Compstem and Hard Disk Storage |
1Nos.
|
| 68 |
YEOI1,Optical Inspection Station,1. Upgrade YEOI1 for Bevel Inspection |
1Nos.
|
| 69 |
YEOI1,Optical Inspection Station,2. Optics needs to be upgraded for existing system |
1Nos.
|
| 70 |
YESR1,SEM Review Station,1. IP computer |
1Nos.
|
| 71 |
YESR1,SEM Review Station,2. HDD higher capacity for all computers |
1Nos.
|
| 72 |
YESR1,SEM Review Station,3. EDX software and computer |
1Nos.
|
| 73 |
YESR1,SEM Review Station,4. Optical Microscope replacement |
1Nos.
|
| 74 |
YESR1,SEM Review Station,5. OS system upgrade (O2) |
1Nos.
|
| 75 |
YEOR1,Optical Review Station,1. Optical module needs to be upgraded. |
1Nos.
|
| 76 |
YEOR1,Optical Review Station,2. ADR software needs to be upgraded |
1Nos.
|
| 77 |
YEOR1,Optical Review Station,3. Upgrade YEOI1 for Bevel Inspection |
1Nos.
|
| 78 |
Supply and installation of MES, as per SOW given in the tender |
1Nos.
|
| 79 |
Supply of IPs for NVM (Single Poly non-volatile memory, as per SOW and specifications given in the tender |
1Nos.
|
| 80 |
Supply, Installation, testing and commissioning of Cleanroom modifications and Utilities for Equipment Movement |
1Nos.
|
| 81 |
De-hook, Move out and Crate 2 old 8” Equipment and re-locate of old 8" Equipment (as per layout drawings given in the tender) |
1Nos.
|